Staff Engineer, Packaging
**Company:**
Qualcomm Technologies, Inc.
**Job Area:**
Engineering Group, Engineering Group > Packaging Engineering
**General Summary:**
Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
As a Staff EDA engineer in the advanced packaging space, you'll be at the forefront of hardware design, focusing on 2.5D/3D IC package design and analysis. Your role involves guiding design and EE teams to ensure alignment with the product roadmap and requirements. We're seeking a highly motivated EDA tool researcher and software developer with a semiconductor packaging background to drive new 2.5D and 3D packaging initiatives aligned with Qualcomm’s roadmaps.
**Job Description:**
+ Develop, qualify, and certify 2.5D and 3D package EDA reference flows based on critical KPIs.
+ Partner with EDA vendors, SOC Foundries, and packaging SAT houses to influence industry EDA roadmap to meet Qualcomm's product requirements
+ Collaborate with internal SOC and packaging design teams to define and deploy the reference flows.
+ Develop and Automate tools and methodology to accelerate Package and System Design, Analysis and Verification processes.
**Minimum Qualifications:**
+ Bachelor's degree in Engineering, Computer Science, or related field.
+ Development-level understanding of Chiplet driven packaging EDA reference flows and EDA landscape.
+ Tool development and automation experience for Cadence APD/SIP, Cadence Innovus, Cadence Virtuoso, Siemens Xpedition, Calibre DRC/LVS, etc.
+ Understanding of package design and SOC design flow from netlist creation to IC Tape out and Package tooling.
+ Self-motivated with ability to solve complex problems.
+ Excellent verbal and written communication skills
**Preferred Qualifications:**
+ MS Electrical Engineering/Computer Science with 2+ years of relevant experience
+ Knowledge of Package/PCB design and simulation flows and tools
+ Experience in Cadence SIP/APD, Siemens Xpedition or other Package Design, Electrical or Thermal modeling EDA tools preferred.
+ Experience in Front End design tools like Cadence Virtuoso, Innovus,
+ Prior strong Experience in RF/SI Software Applications like Cadence Sigrity, Siemens, Keysight, Agilent, Ansys, Dassault
+ Exposure to Circuit solvers such as Agilent ADS or AWR, Full-wave EM solvers such as HFSS, Clarity, CST Microwave Studio, PowerSI or SIWave
+ Writing scripts in: SKILL/RAVEL, Tcl/Tk, VB, PERL, Python, Java, C# in a production environment, Proficient with Unix/Linux OS, utilities, and scripting
+ Leadership skills to help direct, prioritize, and clearly set project tasks per schedule.
+ Communicate milestones and directions to outside team members.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr\_public\_article\_view&sysparm\_article=KB0039028) . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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**EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.**
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
**Pay range** **and Other Compensation & Benefits** **:**
$154,000.00 - $231,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .
If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification